Overview
FORSOLID™ BGA1113 package NVMe series on-chip memory products have the characteristics of small size, light weight , high speed and high reliability, providing users with high-capacity and high density storage product solutions. It can be widely used in miniaturized applications such as handheld terminals, IoT terminals, and embedded motherboards.
Specification:
Physical | Form Factor: | BGA 1113 |
Interface: | PCIe 3.0 x 2 | |
Dimension: | 11.5mmX 13mmX1.35mm | |
Weight: | ≈0.5g | |
Capacity | TLC: | 64GB,128GB, 256GB, 512GB |
Performance | Sequential Read | 1730MB/s |
Sequential Write | 1180MB/s | |
Random Read(4K) IOPS: | 245k | |
Random Write(4K) IOPS: | 195k | |
Electrical | Power Supply | 2.5V, 1.2V, 0.9V |
Power Consumption | Active: ≤1.6W | |
Idle:≤0.2W | ||
Temperature | Operating Temperature | 0℃~70℃ |
Storage Temperature | -40℃~85℃ | |
Humidity | 5%~95%(No Condensing) | |
Vibration | 15g(10~2000Hz) | |
Shock | 1500g/0.5ms | |
Reliability | MTBF: | 2000000hrs |
Total Bytes Written | TLC:3000 times | |
Certificates | CE、FCC、RoHS | |
Optional Functions | Secure Erase | |
Quick Erase | ||
AES-256bit Encryption | ||
Remarks: |
1. The speed performance is related to the SSD capacity and test environments. 2. Power consumptions is related to the SSD capacity and test environments. 3. The marked capacity is the NAND Flash’s capacity, and the real available capacity will be different in different application environments, normally is around 80%~90% marked capacity. |
Dimensions:
Applications: