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System-in-Package(SIP)

System-in-Package(SIP)

V&G through continuous R&D and innovation accumulation of solid-state storage technologies, has formed core technologies such as memory controller and firmware development, ASIC integrated circuit development, system-in package(SIP) development, domain sp

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System-in-Package(SIP)

Via the system-in-package(SiP) method, a variety of functional chips/bare die are packaged side-by-side or superimposed, and functional chips such as processors and NAND Flash are integrated into one package to a complete memory that can be replaced traditional solid-state storage products have the characteristics of small size, large capacity and high performance. V&G Information has mastered the core SiP packaging technology and possesses professional capabilities such as system design, substrate design and simulation, system-level signal integrity analysis, power integrity and thermal power analysis.


  • ◎ Multi-chip package substrate layout design
  • ◎ Chip special packaging design
  • ◎ High-speed signal simulation of chip packaging
  • ◎ Chip mechanics simulation
  • ◎ Chip thermal simulation
  • ◎ Package soldering simulation
  • ◎ Packaging and testing technology
  • ◎ Chip application solutions

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